Skip to main content

Senior Silicon Photonics Packaging R&D Engineer

What you will do

Over the past several years, imec has developed a state-of-the-art silicon photonics (SiPho) technology for realizing next-generation optical interconnects as well as novel optical sensing applications. However, in order for SiPho to break into high-volume, low-cost applications, a cost-effective process for single-mode fiber packaging needs to be developed. As a Senior Silicon Photonics Packaging R&D Engineer, you will be the technical lead in the technology pathfinding for next-generation SiPho optical packaging, and you will work with imec’s photonic and 3D integration engineers to demonstrate such desired low-cost packaging solution. In order to achieve this goal, you will design innovative fiber coupling structures (including beam shaping and mechanical support structures), which will be fabricated using wafer-scale silicon processes in imec’s clean room. In addition, high-throughput wafer-scale fabrication or assembly of micro-optical components on the SiPho platform will be pursued. You will carry out this work in collaboration with material suppliers, vendors of optical fiber connectors, advanced semiconductor packaging/assembly tool vendors, as well as OSATs.

Your responsabilities:

  • Conceive novel concepts for low-cost fiber packaging through optical/mechanical design and modeling of SiPho coupling interfaces.
  • Design a high-throughput monolithic/hybrid wafer-scale process flow to realize the designed interfaces in imec’s SiPho platform.
  • Design process/layout experiments to drive technology development.
  • Test, evaluate and qualify the developed packaging solution (optical/mechanical/reliability).
  • Drive project execution by interacting with integration, test & reliability engineers within imec, as well as with external vendors.
  • Document and report to internal and external stakeholders including imec’s partners and customers.
  • Report to the scientific community at conferences or in scientific journals.
  • Offer Requirements

  • Skills/Qualifications

    Who you are

  • You have obtained a of Science in Mechanical Engineering, Electronics Engineering, Material Science Applied Physics (or equivalent experience through industry background).
  • We need your 4+ years hands-on experience in packaging and measuring fiber-coupled devices.
  • We are looking for your 3+ years hands-on experience with optical system design software, such as Synopsys (RSoft, Code V), Lumerical, Zemax, OSLO.
  • We value your experience of CMOS BEOL wafer-scale processing and flip chip assembly (CoW, WLP, ...).
  • Your experience with silicon photonics is a plus.
  • You are an enthusiastic team player, yet able to independently solve complex problems with limited supervision.
  • We need your excellent English communication skills and willingness to work in a multicultural environment.
  • Senior Silicon Photonics Packaging R&D Engineer

    IMEC, Leuven
    R&D, R&D Engineer, Engineering
    Degree Level: 
    Career level: 
    Apply before: